Electromechanical components are devices which use an electrical signal to create mechanical movement, or mechanical movement to create an electrical signal. They can form an important part of circuit designs where voltages need to be switched or filtered, or heat sensitive components need to be cooled.
The Avnet Abacus portfolio of electromechanical components includes:
- Filters
- Potentiometers
- Relays
- Sensors
- Switches
- Thermal management
Designing the solution to capture your target market
Avnet Abacus is an authorised source for every electromechanical product we offer, giving you access to the newest technologies and solutions available from the world's leading brands including ALPS, Bourns, C&K, Grayhill, Fujitsu, Omron, Panasonic, and TE Connectivity. Our pan-European team of field sales engineers and product specialists work closely with our suppliers to offer you the highest level of engineering support for your design, ensuring that you find the right products for your application.
If you would like to discuss your design with a member of our team contact your local Avnet Abacus sales office, or click the Ask an Expert button to send us your enquiry.
BOYD
HydroSink™ liquid cooling system
The HydroSink™ is an intelligent, innovative, high performance Liquid Cooling System which aims to replace existing air cooled systems.
Bourns
PV® series trimming potentiometers
Bourns has introduced the lead sealed PV Series of Trimpot Trimming Potentiometers which are available in both top and side adjustments.
SCHURTER
MSM16 series Metal Line switches
SCHURTER expands its Metal Line switch series to include an illuminated 16 mm version.
SCHURTER
TTS touchless switch
SCHURTER TTS touchless Switch is a robust stainless-steel switch that brings optical sensing to conventional switching to prevent the spread of pathogens in indoor and outdoor public spaces.
| Image | Product | New |
|---|---|---|
 | Panasonic Industry AHER1281, AHER1282, AHER2281 series HE-R relays Compact size 2 form A and 2 form A 1 form B 80 A/4 form A and 4 form A and 1 form B 40A power relays. Features High capacity 2 form A/2 form A 1 form B: 70A 277VAC 30 x 10 3 ope. max. switching current 80A 4 form A/4 form A 1 form B: 40A 480VAC | |
 | Panasonic Industry AHEA3191, AHEA3192, AHEA4191, AHEA4192 series Compact size 1 form A/１ form A 1 form B 110A power relays for PV inverter, charging station and industrial equipment. Features Compact size and high capacity: W (33mm) x L (38mm) x H (38.8mm) Max. carrying current: 110A Contact GAP (Initial): mi | |
 | Panasonic Industry AQY232G3HS and AQY232G3HSX series PhotoMOS HS SOP 1 form A Recommended LED forward current 2mA, high sensitivity (low current-consumption) miniature SOP4-pin type Features High sensitivity (low current consumption)High capacity: Continuous load current 2.0A*High I/O isolation voltage of | |
 | Panasonic Industry 1401C and 1701C series AMG Amorton Amorphous silicon solar cell indoor type glass substrate. Features Copes easily with device’s required drive voltage Since multiple cells can be simultaneously connected in a series when the solar cells are formed, unlike the fabrication techn | |
 | SCHURTER TA35 rocker 2 pole Circuit breaker for equipment thermal and thermal-magnetic, rocker actuation, 2 pole. Features Circuit breaker thermal and thermal-magnetic 2 pole Snap-in version Positively trip-free release Method of operation acc. to IEC: S-type Different roc | |
 | SCHURTER TA36 rocker Circuit breaker for equipment thermal and thermal-magnetic, rocker actuation, 2 pole. Features Circuit breaker thermal and thermal-magnetic 1/2 pole Snap-in version Positively trip-free release Method of operation acc. to IEC: S-type Different r | |
 | Panasonic Industry AQY212G3HS and AQY212G3HSX series PhotoMOS GU SOP 1 form A high capacity Miniature SOP4-pin type with high capacity up to max. 1.8A in the series Features Continuous load current: max. 1.8A high capacity(AQY212G3HS)I/O isolation voltage: 3,750V(AQY212G3HS)Broad lineup of high capacity ty | |
 | ALPS ALPINE TACT switch™ SKUB series In today’s market for electronic devices such as wearable devices and smartphones, there is a growing demand for miniaturization and higher performance. To meet this demand, electronic components on circuit boards are increasingly densely packed, mak |