Thermal Management
Thermal solutions are not just “fans”, the largest component to proper thermal management is the heatsink and interface material which for most high-performance devices is semi-custom to full custom.
Avnet is focused on helping customers manage their thermal performance by helping in the selection and design of thermal relief solutions. Whether you’re looking for an off-the-shelf solution, heat sinks designed specifically for Avnet’s XRF or the AMD Xilnx Kria K-26 SOMs, or help designing and optimizing your thermal solution, Avnet’s here to help.
Products
Avnet heat sink for Kria K26
The Avnet heat sink for Kria K26 is designed specifically for the AMD Xilinx Kria K26 system on module (SOM). The heat sink mounts directly to the heat spreader plate that comes standard on the K26 SOM. This solution is “turn key” as it includes the mounting hardware as well as the interface “gap” material preinstalled on the heat sink.
Avnet heat sink for XRF SOMs
Avnet XRF RFSoC System-on-Modules require heat dissipation solutions for most applications. This passive heatsink is designed to meet this need and is compatible with all Avnet XRF modules.
Avnet Fansink for XRF SOMs
Avnet XRF RFSoC System-on-Modules require heat dissipation solutions for most applications. This active fan heatsink is designed to meet this need and is compatible with all Avnet XRF modules.
Ultra96 V2 heat sink
The Avnet Ultra96-V2 heat sink is a passive Aavid heatsink for the Ultra96-V2, designed with multiple pedestals and gap pads to provide thermal relief to multiple components. This part may be used to replace the bracket/fan assembly on Ultra96-V2 Rev 1 with a date code earlier than 1940 (built prior to 40th week of 2019).
Boyd EA series for AMD Xilinx SoCs
Aavid Thermalloy, which is now a division of Boyd Corporation, offers standard heatsink solutions for several AMD Xilinx device package families including Artix UltraScale+. The EA‐270 is a series of clip attach bi‐directional square board level heat sinks designed to cool BGA and FPGA devices.
Solutions available in sizes (mm): 17x17, 19x19, 23x23, 27x27, 31x31, 35x35, 40x40, 42.5x42.5. See the <document name> for specific AMD Xilinx device packages.
Boyd Board Level Cooling - EA-270
Custom Solutions
Avnet has the resources to help you design and optimize the thermal solutions for your products. Click here to be contacted by an Avnet representative and start discussing your thermal requirements.