Kingston LPDDR4
Embedded DRAM Components for Device Manufacturers
Kingston DRAM components are designed to meet the needs of embedded devices and are available with low-voltage variants for reduced power consumption.
LPDDR4 FBGA Commercial Temp
| Part Number | Capacity | Description | Package | VDD, VDDQ | Operating Temperature |
|---|---|---|---|---|---|
| D0811PM2FDGUK | 8Gb | 200 ball FBGA LPDDR4 C-Temp | 10x14.5x1.0 | 1.1V | -25°C ~ +85°C |
| B1621PM2FDGUK | 16Gb | 200 ball FBGA LPDDR4 C-Temp | 10x14.5x1.0 | 1.1V | -25°C ~ +85°C |
LPDDR4 FBGA Industrial Temp
| Part Number | Capacity | Description | Package | VDD, VDDQ | Operating Temperature |
|---|---|---|---|---|---|
| D0811PM2FDGUKW | 8Gb | 200 ball FBGA LPDDR4 I-Temp | 10x14.5x1.0 | 1.1V | -40°C ~ +95°C |
| B1621PM2FDGUKW | 16Gb | 200 ball FBGA LPPDDR4 I-Temp | 10x14.5x1.0 | 1.1V | -40°C ~ +95°C |
What makes Kingston unique?
Chip validation
Kingston works with many chipset vendors to test and qualify products and has an in-house lab for internal component testing and compatibility testing on multiple chipset platforms.
High volume
Leveraging high volume material purchasing means we can maintain competitive pricing. Look to us for global high-volume, mass production facilities with advanced manufacturing technology and expertise.
Backend packaging technology
ISO/TS16949 certified manufacturing facilities allow for mass production with advanced multi-die stacking packaging technology plus advanced memory testing equipment. Kingston maintains a high standard for quality control and product reliability testing.
Engineering support
Live FAE and technical resource support is available during the design-in phase. For troubleshooting, Kingston maintains an in-house lab with multiple chipset platforms available.
